Radiant floor heating distributes heat through a large surface area integrated into the floor construction, providing uniform heat emission throughout the occupied space.
In this type of system, thermal insulation installed beneath the heating layer plays an important role in limiting downward heat transfer and directing a greater proportion of the supplied heat towards the conditioned environment.
Radiant floor systems can operate with relatively low water temperatures compared with conventional high-temperature heating systems, making them particularly suitable for integration with high-efficiency heat generators and heat pumps.
POLIISO® AD is a rigid closed-cell polyisocyanurate (PIR) insulation panel particularly suited to floor and radiant-floor applications. The panel is faced on both sides with embossed aluminium and provides a declared thermal conductivity λD of 0.022 W/mK, allowing high thermal resistance to be achieved with relatively limited insulation thickness.
With a compressive strength of ≥ 150 kPa, POLIISO® AD combines high thermal performance with mechanical properties suitable for integration into correctly designed floor build-ups.
