A thermal bridge is a localised area of the building envelope where heat flow is greater than through the surrounding construction. It can occur because of changes in geometry, materials or interruptions in the continuity of the thermal insulation layer.
Typical thermal bridges are found at columns, beams, floor edges, balconies, lintels and other structural junctions. If not correctly addressed, these areas can increase heat transfer through the building envelope and reduce internal surface temperatures, potentially increasing the risk of surface condensation and mould growth under unfavourable temperature and humidity conditions.
Maintaining the continuity of thermal insulation across these structural elements is therefore an important part of the thermal design of the building envelope.
X-FOAM® EASY PIL is an extruded polystyrene (XPS) insulation board specifically designed for the treatment of thermal bridges. The product is manufactured without extrusion skin and with milled surfaces, providing a surface specifically designed to facilitate integration with compatible adhesives, mortars and finishing systems.
X-FOAM® EASY PIL is available in large-format 600 × 3000 mm boards, with thicknesses from 25 to 100 mm, and provides a compressive strength of ≥ 200 kPa.
