Detail
Flat roofs
  • Inverted roof
  • Hot roof
Sloped roofs
  • Sloped roofs with ventilated gap below membrane
  • Insulation of sloped roofs on wood beams
  • Sloped roofs with ventilated gap over membrane
  • Microventilated roofs
Cavity walls insulation
  • Cavity walls
Exterior insulation
  • Ventilated walls
  • External insulation
Interior insulation
  • Interior
Walls below ground
  • Walls below ground
Residential floors
  • Floors
Industrial floors
  • Cold storage rooms floors
Thermal bridges
  • Insulation of thermal bridges
Isothermal trucks
  • Isothermal trucks
Infills and renovations in humid rooms
  • Infills and renovations in humid rooms
Sandwich panel
  • Sandwich panel

POLIISO® PLUS

 

POLIISO® PLUS is a thermal insulation panel made of rigid closed-cell polyisocyanurate (PIR) foam, faced on both sides with aluminium foil. With a declared thermal conductivity λD of 0.022 W/mK according to EN 13165, the panel provides high thermal performance and allows high thermal resistance to be achieved while limiting the thickness of the insulation layer.

 

POLIISO® PLUS has a compressive strength of ≥ 150 kPa and is available in thicknesses from 20 to 140 mm. The standard panel size is 600 × 1200 mm, providing a practical format for different building-envelope and floor applications.

 

Thanks to its combination of low thermal conductivity, aluminium facings and dimensional versatility, POLIISO® PLUS can be integrated into different construction build-ups. Its applications include warm roofs beneath synthetic waterproofing membranes, cavity wall insulation, floor insulation and underfloor heating systems.

 

This versatility makes POLIISO® PLUS suitable for projects where the same high-performance PIR insulation technology can be used across different elements of the building envelope.

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Advantages

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Useful to know

POLIISO® PLUS combines a λD of 0.022 W/mK with the versatility required for different roof, wall and floor applications. Its low declared thermal conductivity is particularly...

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Warnings

With a declared thermal conductivity of 0.022 W/mK, POLIISO® PLUS can provide significant thermal resistance even where the space available for insulation needs to be carefully...

Applications with POLIISO® PLUS

Ediltec X FOAM HBD interpiano 1

XPS floor insulation

POLIISO PLUS parete cava–1

CAVITY WALLS INSULATION – POLIISO

Ediltec POLIISO VV Tetto caldo 1

THERMAL INSULATION FOR HOT FLAT ROOFS UNDER SYNTHETIC MEMBRANE

Ediltec POLIISO SB tetto giardino 1

Warm Green Roof / Garden Roof

Others Products...

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Frequently asked questions - faq

Why choose POLIISO® PLUS when insulation thickness is limited?

POLIISO® PLUS has a declared thermal conductivity λD of 0.022 W/mK. This allows high thermal resistance to be achieved with relatively limited PIR thickness, making it suitable for roof, wall and floor insulation applications.

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