POLIISO® PLUS has a declared thermal conductivity λD of 0.022 W/mK. This allows high thermal resistance to be achieved with relatively limited PIR thickness, making it suitable for roof, wall and floor insulation applications.
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POLIISO® PLUS is a thermal insulation panel made of rigid closed-cell polyisocyanurate (PIR) foam, faced on both sides with aluminium foil. With a declared thermal conductivity λD of 0.022 W/mK according to EN 13165, the panel provides high thermal performance and allows high thermal resistance to be achieved while limiting the thickness of the insulation layer.
POLIISO® PLUS has a compressive strength of ≥ 150 kPa and is available in thicknesses from 20 to 140 mm. The standard panel size is 600 × 1200 mm, providing a practical format for different building-envelope and floor applications.
Thanks to its combination of low thermal conductivity, aluminium facings and dimensional versatility, POLIISO® PLUS can be integrated into different construction build-ups. Its applications include warm roofs beneath synthetic waterproofing membranes, cavity wall insulation, floor insulation and underfloor heating systems.
This versatility makes POLIISO® PLUS suitable for projects where the same high-performance PIR insulation technology can be used across different elements of the building envelope.
POLIISO® PLUS has a declared thermal conductivity λD of 0.022 W/mK. This allows high thermal resistance to be achieved with relatively limited PIR thickness, making it suitable for roof, wall and floor insulation applications.